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Title:

Determination of the Performance of Chip Seal, Applied With HSKSC (Accelerated Chip Seal Simulation Device) on Unbound Base

Accession Number:

01333302

Record Type:

Component

Abstract:

Chip seals applied on unbound granular base are an asphalt pavement type that is widely used in countries such as Turkey, Australia, New Zealand, and South Africa. Although several methods and techniques regarding design of chip seals and measurement of performance of chip seal on-site and under laboratory conditions have been developed in recent years, there is no evidence that a device, system or method, allowing cost-effectively pre-measurement of performance of chip seals, existed in laboratory setting. In this study, Accelerated Chip Seal Simulation Device (HSKSC), which was developed and designed in Suleyman Demirel University (Turkey) and allows measurement of chip seal, applied on unbound granular base, under laboratory conditions and desired climate conditions as described, and results of two different performance tests performed with this device were discussed. Two different chip seals (single-layer and double-layer) were designed with this device and double-layer, single-layer chip seal samples were subjected to performance test in the device under a mild climate and hot climate respectively. During the tests, macro surface texture and numbers of friction-skid resistance were measured. As the number of cycles increases considerable decrease appeared particularly on macro texture and a limited decrease in micro texture. It was concluded that the performance tests to be carried out by means of prototype Accelerated Chip Seal Simulation Device (HSKSC) would be useful for design of chip seal applied on unbound granular bases.

Monograph Accession #:

01329018

Report/Paper Numbers:

11-1225

Language:

English

Corporate Authors:

Transportation Research Board

500 Fifth Street, NW
Washington, DC 20001 United States

Authors:

Karasahin, Mustafa
Gurer, Cahit
Taciroglu, Murat Vergi
Aktas, Bekir

Pagination:

12p

Publication Date:

2011

Conference:

Transportation Research Board 90th Annual Meeting

Location: Washington DC, United States
Date: 2011-1-23 to 2011-1-27
Sponsors: Transportation Research Board

Media Type:

DVD

Features:

Figures; Photos; References (19) ; Tables (1)

Uncontrolled Terms:

Subject Areas:

Highways; Materials; Pavements; I33: Other Materials used in Pavement Layers

Source Data:

Transportation Research Board Annual Meeting 2011 Paper #11-1225

Files:

TRIS, TRB

Created Date:

Feb 17 2011 5:43PM